RA320-C22-L is an aligner that has the Z-axis and X-axis mechanisms for compensating the wafer position in addition to the θ-axis. This is a small and lightweight type to reduce the installation footprint. Various kinds of the wafer alignment operations are available using the non-contact optical sensors with high performance, and the high-accuracy alignment is achieved.

Wafer to be handled: Silicon, transparent (glass), and laminate wafers

Small type and lightweight.

Small footprint.